4.1.1. Changelog for the TI TMS570-based BMS-Master
4.1.1.1. v1.2.3-0
Fix wiring of U6601 in schematic and layout.
Fix vendor number of Y6100 (SiT1618BA-32-33N-20.000000) in BOM.
Include a suffix in the version declaration.
4.1.1.2. v1.2.2
Update RTC INTA output circuitry to work independent of backup battery presence.
Add design variant “production” as primary configuration for board production.
Add SBC config to release file (check NOTICE).
4.1.1.3. v1.2.1
Update RTC INTA output circuitry for compatibility with higher supply voltages.
Rearrange wiring of SBC wake signals: only ignition signal on WAKE1, RTC and CAN1 on WAKE2.
4.1.1.4. v1.2.0
Optimize design by removing the second SBC (peripheral SPC), now featuring only a single SBC.
Fix wiring of Ethernet PHY in schematic and layout.
Control of CAN1 enable and !standby signals directly from MCU instead of port expander to increase compatibility with upcoming CAN bootloader.
Update schematic comment related to SBC debug pulse length.
4.1.1.5. v1.1.5
Fix Farnell order code for 100nF/50V/0402.
Update project BOM.
4.1.1.6. v1.1.4
Improve SBC wake-up pulse generation circuit by changing value of R7233 to 470kOhm.
4.1.1.7. v1.1.3
Fix swapped INTA/INTB pinout of U6400 (PCF2131TF).
Add OSHWA logo on PCB.
Modify power MOSFET and according control circuitry (Q4400-Q4402) for switching external insulation monitor (current rating of previous design was too weak).
4.1.1.8. v1.1.2
Fix assignment of memory devices (MRAM, FRAM, FLASH) to SPI3 chip select pins (net labels were swapped).
Split oscillator (Y6100) into two different part numbers and BOM items (one part for 20 MHz and 25 MHz).
Add voltage limiting Zener diodes to gates of Q6401 and Q6404.
Add 100 nF capacitor to “ON” pin of U7300 in order to improve transient immunity.
Fix faulty solder paste layer on component U7100.
Replace Ethernet socket J2001 due to availability issues (old part number: Wuerth 615008185121, new part number: Wuerth 615008137421).
4.1.1.9. v1.1.1
Add clamping diodes for contactor feedback resistor dividers in order to protect inputs of port expander.
Add clamping diodes to insulation monitor PWM and OK inputs.
Adjust contactor connectors pinout to match foxBMS 1 Master pinout.
Replace R8014 and R8017 10k resistors with 10R resistors due to amplifier gain error.
Add placement option to use ADUM6401 as a digital isolator for the CAN2 interface.
Fix a typo in EMIF connector silk screen.
Improve free space around debug connector (debug connector was moved towards upper edge of board).
Change global polygon connect style to relief connect in order to improve solderabilty of through-hole connectors.
Fix solder paste areas for Mictor debug connector.
Modify all mounting holes to fit Wuerth SMT spacers (outer diameter = 6mm).
Remove interlock high-side switch from default component variant due to availability issues.
Add hardware board version coding using IO1_0 to IO1_7 of port-expander1.
4.1.1.10. v1.1.0
Replace CAN transceiver with TCAN1043HDQ1 (SOIC-14 package) due to availability issues.
Add battery holder for CR1225 RTC battery (BR2470 battery is now optional).
Change value of all I2C pull-up resistors from 5.1 \({k\Omega}\) to 2.49 \({k\Omega}\).
Remove buck-boost converter IC from “default” component variant due to availability issues.
Remove Ethernet PHY IC from “default” component variant due to availability issues.
Finalize PCB layout.
Add mechanical dimensions to draftman document.
4.1.1.11. v1.0.2
Add digital isolator with integrated power for CAN2 interface.
Add connectors for interface and extension boards.
Add bypass for buck-boost converter.
Split board supply into clamp 30 and clamp 30C.
Add additional protection circuit for clamp 30C supply input.
Remove isolated USB interface.
Add test points for interlock circuit.
4.1.1.12. v1.0.1
Correct the supply of V:sub:dd of the smart power switch (from 12V to 5V).
4.1.1.13. v1.0.0
Initial version.